TZTEK AVI-PCB-OL series On-line Visual Inspection Equipment adaptable Integrate TZTEK's independent research and development of light source module, AI deep learning and other patented technologies to support ultra-large board (750 × 650 mm) detection, with high efficiency, high adaptability and other characteristics, can be widely used in the field of PCB.
| Model | AVI-PCB-OL18C | AVI-PCB-OL15C | AVI-PCB-OL12C | AVI-PCB-OL10C | |
| CCD resolution（μm/pixel） | 18 | 15 | 12 | 10 | |
| External dimensions（mm） | 2100×1534×2100（L×W×H） | ||||
| Equipment weigh（t t） | 2 | ||||
| Equipment powe（r Vac,Hz,KW） | 380，50，16 | ||||
| Processing method | Full-automatic double-sided scanning, automatic loading and unloading | ||||
| Inspection area(mm) | 200×200（MIN） | 650×750（MAX） | |||
| Reference material format | Gerber（RS274X)、ODB++ | ||||
| Detection board thickness(mm) | 0.1 - 5 | ||||
| CT（pnl/h） | 600（ Based on board size：500×600 mm） | ||||
| Defect confirmation | VRS 离线判定 | ||||
| VRS off-line decision | Copper surface area covered by gold surface/organic flux: Scratches, pinholes, gold particles, metal bumps, dents, discolorations, copper leakage, contamination, nicks, insufficient etching, excessive etching, foreign matters, non-gold plating, circular PAD diameter out-of-tolerance Anti-welding zone: Scratch, lack of anti-welding (exposed gold/exposed copper/exposed base material), through hole (exposed gold/exposed copper), foreign matter, green paint peeling, green paint offset, pollution, green paint crack, small hole plugging Base material area: Copper residue, scratch and bottom leakage Line area: Notch, open circuit, short circuit, scratch, exposed copper, pinhole, gold particle, metal bump, discoloration, oxidation, pollution, foreign matter, insufficient etching, excessive etching Line area under green paint: Notch, open circuit, short circuit, scratch, foreign matter | ||||
| Detection material | Type of substrate：HASL board, immersion gold board, gold-plated board, immersion silver board, immersion tin board, OSP anti-oxidation board, etc. | ||||
| Temperature and humidity | 22±2℃ ， 50±10% | ||||
