Model | AVI-IC-A025C | ||||
CCD resolution(μm/pixel) | 2.5 (front), 5 (back) (16K color high-precision CCD | ||||
External dimensions(mm) | 1790×2250×1990(L×W×H) | ||||
Equipment weigh(t t) | 3 | ||||
Equipment powe(r Vac,Hz,KW) | 380,50,16 | ||||
Processing method | Full-automatic double-sided scanning, NG slot, slot to be inspected | ||||
Inspection area(mm) | 30×50(MIN) | 120×300(MAX) | |||
CT(pnl/h) | Plate width<40 mm(Once scan):270 40 mm≤Plate width<80 mm(Twice Scan ):200 80 mm≤Plate width<120 mm(Triple scan):140 (Double-sided inspection) | ||||
Reference material format | Gerber (RS274X)、ODB++ | ||||
Detection board thickness(mm) | 0.06 - 2 | ||||
Defect confirmation | VRS off-line decision | ||||
Defect range | Copper surface area covered by gold surface/organic flux: Scratches, pinholes, gold particles, metal bumps, dents, discolorations, copper leakage, contamination, nicks, insufficient etching, excessive etching, foreign matters, non-gold plating, circular PAD diameter out-of-tolerance Anti-welding zone: Scratch, lack of anti-welding (exposed gold/exposed copper/exposed base material), through hole (exposed gold/exposed copper), foreign matter, green paint peeling, green paint offset, pollution, green paint crack, small hole plugging Base material area: Copper residue, scratch and bottom leakage Line area: Notch, open circuit, short circuit, scratch, exposed copper, pinhole, gold particle, metal bump, discoloration, oxidation, pollution, foreign matter, insufficient etching, excessive etching Line area under green paint: Notch, open circuit, short circuit, scratch, foreign matter | ||||
Detection material | Type of substrate: PBGA、CSP、 RF、 COB、 OSP、BOC、MMG、WBGA、PSAP、MCM-BGA、FCBGA、uBGATM | ||||
Temperature and humidity | 22±2℃ , 50±10% |