AVI-IC-A025C High-precision Automatic Visual Inspection Equipment
TZTEK VAVI-IC-A025C High-precision Automatic Visual Inspection Equipment adopts submicron precision drive control platform and integrates calibration, compensation algorithm and other technologies to ensure higher imaging quality and alignment accuracy. It integrates detection and measurement, and combines traditional algorithm with AI algorithm to effectively filter false points. The analytical accuracy can reach 2.5 μm.
SPECIFICATION PARAMETER
Model AVI-IC-A025C
CCD resolution(μm/pixel) 2.5 (front), 5 (back) (16K color high-precision CCD
External dimensions(mm) 1790×2250×1990(L×W×H)
Equipment weigh(t t) 3
Equipment powe(r Vac,Hz,KW) 380,50,16
Processing method Full-automatic double-sided scanning, NG slot, slot to be inspected
Inspection area(mm) 30×50(MIN) 120×300(MAX)
CT(pnl/h)

Plate width<40 mm(Once scan):270

40 mm≤Plate width<80 mm(Twice Scan ):200

80 mm≤Plate width<120 mm(Triple scan):140

(Double-sided inspection)

Reference material format Gerber (RS274X)、ODB++
Detection board thickness(mm) 0.06 - 2
Defect confirmation VRS off-line decision
Defect range

Copper surface area covered by gold surface/organic flux: Scratches, pinholes, gold particles, metal bumps, dents, discolorations, copper leakage, contamination, nicks, insufficient etching, excessive etching, foreign matters, non-gold plating, circular PAD diameter out-of-tolerance

Anti-welding zone: Scratch, lack of anti-welding (exposed gold/exposed copper/exposed base material), through hole (exposed gold/exposed copper), foreign matter, green paint peeling, green paint offset, pollution, green paint crack, small hole plugging

Base material area: Copper residue, scratch and bottom leakage

Line area: Notch, open circuit, short circuit, scratch, exposed copper, pinhole, gold particle, metal bump, discoloration, oxidation, pollution, foreign matter, insufficient etching, excessive etching

Line area under green paint: Notch, open circuit, short circuit, scratch, foreign matter

Detection material Type of substrate: PBGA、CSP、 RF、 COB、 OSP、BOC、MMG、WBGA、PSAP、MCM-BGA、FCBGA、uBGATM
Temperature and humidity 22±2℃ , 50±10%