CO2 Laser Drilling Equipment
TZTEK CO2 Laser Drilling Equipment adopts stable CO2 laser and optical path system, high-speed and high-precision galvanometer and motion platform, is equipped with high-precision CCD camera, automatic loading and unloading structure, and integrates comprehensive technologies such as TZTEK vision, calibration, compensation algorithm, and precision control, which can ensure the quality, efficiency, accuracy and stability of PCB micro-blind hole/through-hole drilling. It is suitable for micro-blind hole/through-hole drilling of HDI board, IC carrier board, soft and hard combination board, and meets many drilling methods such as DLD (browning, blackening), Conform mask, Large window, etc.
Processing Capacity
DLD borehole diameter：75-200 μm or 50-125 μm
50um
75um
100um
125um
150um
200um
SPECIFICATION PARAMETER
| Model | CO2 Laser Drilling Equipment | ||||
| Processed product size（mm） | 650×550（Max）*2 | ||||
| Galvanometer scanning frequency（Hz） | ≥3300*2 | ||||
| Galvanometer scanning range（mm） | 82×82（Max）*2 | ||||
| X, Y platform speed（mm/s） | 1000（Max） | ||||
